Effects of thinning and heating for TiO2/AlInP junctions

dc.contributor.authorJ. Mäkelä
dc.contributor.authorM. Tuominen
dc.contributor.authorM. Yasir
dc.contributor.authorV. Polojärvi
dc.contributor.authorA. Aho
dc.contributor.authorA. Tukiainen
dc.contributor.authorM. Kuzmin
dc.contributor.authorM.P.J. Punkkinen
dc.contributor.authorP. Laukkanen
dc.contributor.authorK. Kokko
dc.contributor.authorM. Guina
dc.contributor.organizationfi=materiaalitutkimuksen laboratorio|en=Materials Research Laboratory|
dc.contributor.organization-code1.2.246.10.2458963.20.15561262450
dc.contributor.organization-code2606706
dc.converis.publication-id2631886
dc.converis.urlhttps://research.utu.fi/converis/portal/Publication/2631886
dc.date.accessioned2022-10-28T12:35:00Z
dc.date.available2022-10-28T12:35:00Z
dc.description.abstract<p> <span style="color: rgb(46, 46, 46); line-height: 23.68px; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 16px; word-spacing: -1.24px;">TiO</span><sub style="margin: 0px; padding: 0px; border: 0px currentColor; border-image: none; color: rgb(46, 46, 46); line-height: 0; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 0.75em; word-spacing: -1.24px;">2</sub><span style="color: rgb(46, 46, 46); line-height: 23.68px; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 16px; word-spacing: -1.24px;">/AlInP junctions are used to construct the antireflection coatings for solar cells and to passivate III&ndash;V nanostructure surfaces. The thickness of AlInP epilayer affects light absorption and appropriate Al composition determining further the energy barrier for carriers. We report on reducing the AlInP thickness by dry etching down to 10&nbsp;nm without introducing harmful defect states at TiO</span><sub style="margin: 0px; padding: 0px; border: 0px currentColor; border-image: none; color: rgb(46, 46, 46); line-height: 0; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 0.75em; word-spacing: -1.24px;">2</sub><span style="color: rgb(46, 46, 46); line-height: 23.68px; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 16px; word-spacing: -1.24px;">/AlInP interface and AlInP/GaInP interface below, according to photoluminescence. Synchrotron-radiation photoelectron spectroscopy reveals that increased oxidation of phosphorus is not harmful to TiO</span><sub style="margin: 0px; padding: 0px; border: 0px currentColor; border-image: none; color: rgb(46, 46, 46); line-height: 0; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 0.75em; word-spacing: -1.24px;">2</sub><span style="color: rgb(46, 46, 46); line-height: 23.68px; font-family: Arial, Helvetica, &quot;Lucida Sans Unicode&quot;, &quot;Microsoft Sans Serif&quot;, &quot;Segoe UI Symbol&quot;, STIXGeneral, &quot;Cambria Math&quot;, &quot;Arial Unicode MS&quot;, sans-serif; font-size: 16px; word-spacing: -1.24px;">/AlInP and that post heating of the material enhances AlInP oxidation and group III element segregation resulting in decreased material homogeneity.</span></p>
dc.format.pagerange6
dc.format.pagerange9
dc.identifier.jour-issn0368-2048
dc.identifier.olddbid177490
dc.identifier.oldhandle10024/160584
dc.identifier.urihttps://www.utupub.fi/handle/11111/33687
dc.identifier.urnURN:NBN:fi-fe2021042714725
dc.language.isoen
dc.okm.affiliatedauthorMäkelä, Jaakko
dc.okm.affiliatedauthorTuominen, Marjukka
dc.okm.affiliatedauthorYasir, Muhammad
dc.okm.affiliatedauthorKuzmin, Mikhail
dc.okm.affiliatedauthorPunkkinen, Marko
dc.okm.affiliatedauthorLaukkanen, Pekka
dc.okm.affiliatedauthorKokko, Kalevi
dc.okm.discipline114 Physical sciencesen_GB
dc.okm.discipline216 Materials engineeringen_GB
dc.okm.discipline221 Nanotechnologyen_GB
dc.okm.discipline114 Fysiikkafi_FI
dc.okm.discipline216 Materiaalitekniikkafi_FI
dc.okm.discipline221 Nanoteknologiafi_FI
dc.okm.internationalcopublicationinternational co-publication
dc.okm.internationalityInternational publication
dc.okm.typeA1 ScientificArticle
dc.publisherElsevier
dc.publisher.countryNetherlandsen_GB
dc.publisher.countryAlankomaatfi_FI
dc.publisher.country-codeNL
dc.relation.doi10.1016/j.elspec.2015.08.004
dc.relation.ispartofjournalJournal of Electron Spectroscopy and Related Phenomena
dc.relation.volume205
dc.source.identifierhttps://www.utupub.fi/handle/10024/160584
dc.titleEffects of thinning and heating for TiO2/AlInP junctions
dc.year.issued2015

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