Edge Computing with Embedded AI: Thermal Image Analysis for Occupancy Estimation in Intelligent Buildings

dc.contributor.authorAly Metwaly
dc.contributor.authorJorge Peña Queralta
dc.contributor.authorVictor Kathan Sarker
dc.contributor.authorTuan Nguyen Gia
dc.contributor.authorOmar Nasir
dc.contributor.authorTomi Westerlund
dc.contributor.organizationfi=sulautettu elektroniikka|en=Embedded Electronics|
dc.contributor.organization-code1.2.246.10.2458963.20.20754768032
dc.contributor.organization-code2606802
dc.converis.publication-id44848973
dc.converis.urlhttps://research.utu.fi/converis/portal/Publication/44848973
dc.date.accessioned2022-10-28T13:35:25Z
dc.date.available2022-10-28T13:35:25Z
dc.format.pagerange1
dc.format.pagerange6
dc.identifier.isbn978-1-4503-7652-5
dc.identifier.olddbid182964
dc.identifier.oldhandle10024/166058
dc.identifier.urihttps://www.utupub.fi/handle/11111/40242
dc.identifier.urnURN:NBN:fi-fe2021042823383
dc.language.isoen
dc.okm.affiliatedauthorPeña Queralta, Jorge
dc.okm.affiliatedauthorSarker, Victor
dc.okm.affiliatedauthorNguyen, Tuan
dc.okm.affiliatedauthorWesterlund, Tomi
dc.okm.discipline113 Computer and information sciencesen_GB
dc.okm.discipline213 Electronic, automation and communications engineering, electronicsen_GB
dc.okm.discipline113 Tietojenkäsittely ja informaatiotieteetfi_FI
dc.okm.discipline213 Sähkö-, automaatio- ja tietoliikennetekniikka, elektroniikkafi_FI
dc.okm.internationalcopublicationnot an international co-publication
dc.okm.internationalityInternational publication
dc.okm.typeA4 Conference Article
dc.publisher.countryUnited Statesen_GB
dc.publisher.countryYhdysvallat (USA)fi_FI
dc.publisher.country-codeUS
dc.publisher.placeNew York, NY
dc.relation.conferenceINTelligent Embedded Systems Architectures and Applications
dc.relation.doi10.1145/3372394.3372397
dc.source.identifierhttps://www.utupub.fi/handle/10024/166058
dc.titleEdge Computing with Embedded AI: Thermal Image Analysis for Occupancy Estimation in Intelligent Buildings
dc.title.bookINTESA2019: Proceedings of the INTelligent Embedded Systems Architectures and Applications Workshop 2019
dc.year.issued2019

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