Silver diamine fluoride and resin-dentin bonding: Optimization of application protocols

dc.contributor.authorUctasli Merve
dc.contributor.authorStape Thiago Henrique Scarabello
dc.contributor.authorMutluay Mustafa Murat
dc.contributor.authorTezvergil-Mutluay Arzu
dc.contributor.organizationfi=hammaslääketieteen laitos|en=Institute of Dentistry|
dc.contributor.organizationfi=tyks, vsshp|en=tyks, varha|
dc.contributor.organization-code1.2.246.10.2458963.20.64787032594
dc.converis.publication-id180473958
dc.converis.urlhttps://research.utu.fi/converis/portal/Publication/180473958
dc.date.accessioned2025-08-28T02:10:54Z
dc.date.available2025-08-28T02:10:54Z
dc.description.abstract<p>Objective</p><p>To evaluate the effect of SDF-based treatments following delayed bonding and surface treatment approaches on resin-dentin bonding efficiency of a universal adhesive under different application modes.<br>Methods</p><p>Mid-coronal dentin surfaces from sound third molars were randomly treated with 38% silver diamine fluoride (SDF) and/or additionally with potassium iodide (SDF/KI). Untreated dentin served as control. SDF-treated teeth were assigned to groups according to surface treatment approaches (air-abrasion and water rinsing), the application mode of a mild universal adhesive (etch-and-rinse or self-etch) and delayed bonding (immediate, 7, 15 or 30 days). Microtensile bond strength (n = 5), SEM analyses of hybrid layer formation and dentin etching patterns and dentin permeability were evaluated. Data were analyzed with factorial ANOVA.<br>Results</p><p>SDF-based treatments affected dentin bonding depending on application mode and surface treatment approaches (p<0.001). Etch-and-rinse bonding was not affected by SDF-based treatments (<em>p</em><0.05), producing more homogenous hybrid layers. While dentin etching patterns of etch-and-rinse application were not affected by SDF-based treatments, self-etching presented limitations. Bond strength reductions of self-etched dentin were restored by silver-removal strategies containing a water-rinsing step (<em>p</em><0.05). Delayed bonding additionally reduced dentin permeability (<em>p</em><0.05), further decreasing with longer periods (<i>p</i><0.05).<br>Conclusion</p><p>Although the negative effect of SDF-based treatments on resin-dentin bonding can be avoided by strategies incorporating water-rinsing before hybridization, delayed bonding brings additional advantages due to higher mineral deposition.<br>Clinical significance</p><p>While the etch-and-rinse technique avoids major bonding drawbacks to SDF-treated dentin, self-etch bonding requires removal of excess silver deposits before hybridization. Performing SDF-based treatments and dentin hybridization in separate sessions (>15 days apart) potentialize mineral deposition improving caries control and service life of composite restorations.</p>
dc.identifier.eissn1879-0127
dc.identifier.jour-issn0143-7496
dc.identifier.olddbid208695
dc.identifier.oldhandle10024/191722
dc.identifier.urihttps://www.utupub.fi/handle/11111/58285
dc.identifier.urlhttps://doi.org/10.1016/j.ijadhadh.2023.103468
dc.identifier.urnURN:NBN:fi-fe2025082792092
dc.language.isoen
dc.okm.affiliatedauthorÜçtasli, Merve
dc.okm.affiliatedauthorStape, Thiago
dc.okm.affiliatedauthorMutluay, Murat
dc.okm.affiliatedauthorTezvergil-Mutluay, Arzu
dc.okm.affiliatedauthorDataimport, tyks, vsshp
dc.okm.discipline313 Dentistryen_GB
dc.okm.discipline313 Hammaslääketieteetfi_FI
dc.okm.internationalcopublicationnot an international co-publication
dc.okm.internationalityInternational publication
dc.okm.typeA1 ScientificArticle
dc.publisherElsevier Ltd
dc.publisher.countryUnited Kingdomen_GB
dc.publisher.countryBritanniafi_FI
dc.publisher.country-codeGB
dc.relation.articlenumber103468
dc.relation.doi10.1016/j.ijadhadh.2023.103468
dc.relation.ispartofjournalInternational Journal of Adhesion and Adhesives
dc.relation.volume126
dc.source.identifierhttps://www.utupub.fi/handle/10024/191722
dc.titleSilver diamine fluoride and resin-dentin bonding: Optimization of application protocols
dc.year.issued2023

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