Commercial compact fusion triggered REBCO tape industry: Pulsed laser deposition technology opportunities and challenges

dc.contributor.authorZhao, Yue
dc.contributor.authorWu, Yue
dc.contributor.authorGoyal, Amit
dc.contributor.authorHuhtinen, Hannu
dc.contributor.authorPaturi, Petriina
dc.contributor.authorTsuchiya, Yuji
dc.contributor.organizationfi=Wihurin fysiikantutkimuslaboratorio|en=Wihuri Physical Laboratory|
dc.contributor.organization-code1.2.246.10.2458963.20.26581883332
dc.converis.publication-id499784555
dc.converis.urlhttps://research.utu.fi/converis/portal/Publication/499784555
dc.date.accessioned2026-01-21T12:08:03Z
dc.date.available2026-01-21T12:08:03Z
dc.description.abstractThe rapid rise of commercial compact fusion devices has triggered fast-growing demand for high-temperature superconducting tapes, creating a major opportunity for the high-temperature superconducting (HTS) tape industry. Pulsed laser deposition (PLD) has been extensively applied for fabrication of heteroepitaxial HTS wires or tapes based on REBCO-type superconductor, also referred to as, coated conductors (CCs). A combination of multi-plume, multi-turn deposition technique and use of high-power excimer lasers has enabled and accelerated the industrialization of REBCO coated conductors. Currently, the annual production of top-tier PLD-based, HTS-wire manufacturers exceeds 3,000 km-12 mm, contributing to over half of the total global HTS wire production. PLD-REBCO tapes have demonstrated excellent in-field performance (Ic > 200 A-4 mm @20K, 20T, B//c) and competitive pricing (∼$20/m). PLD technology continues to evolve, demonstrating strong competitive advantages. However, challenges remain in further cost reduction, process stability, and increasing efficiency of raw material utilization. AI-based data mining and tackling emerging fundamental issues are seen as potential solutions to further improve stability and performance.
dc.identifier.eissn2772-8307
dc.identifier.olddbid212149
dc.identifier.oldhandle10024/195167
dc.identifier.urihttps://www.utupub.fi/handle/11111/39011
dc.identifier.urlhttps://doi.org/10.1016/j.supcon.2025.100188
dc.identifier.urnURN:NBN:fi-fe202601215580
dc.language.isoen
dc.okm.affiliatedauthorHuhtinen, Hannu
dc.okm.affiliatedauthorPaturi, Petriina
dc.okm.discipline114 Physical sciencesen_GB
dc.okm.discipline213 Electronic, automation and communications engineering, electronicsen_GB
dc.okm.discipline114 Fysiikkafi_FI
dc.okm.discipline213 Sähkö-, automaatio- ja tietoliikennetekniikka, elektroniikkafi_FI
dc.okm.internationalcopublicationinternational co-publication
dc.okm.internationalityInternational publication
dc.okm.typeB1 Other Article
dc.publisherElsevier BV
dc.publisher.countryNetherlandsen_GB
dc.publisher.countryAlankomaatfi_FI
dc.publisher.country-codeNL
dc.relation.articlenumber100188
dc.relation.doi10.1016/j.supcon.2025.100188
dc.relation.ispartofjournalSuperconductivity
dc.relation.volume15
dc.source.identifierhttps://www.utupub.fi/handle/10024/195167
dc.titleCommercial compact fusion triggered REBCO tape industry: Pulsed laser deposition technology opportunities and challenges
dc.year.issued2025

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