Effects of post oxidation of SiO2/Si interfaces in ultrahigh vacuum below 450 °C

Abstract

<p>Growing SiO₂ layer by wet-chemical oxidation of Si surfaces before growth of another insulating film(s) is a used method to passivate Si interfaces in applications (e.g., solar cell, photodiode) at low temperatures (LT) below 450 °C. We report on potential of LT ultrahigh-vacuum (UHV) treatments combined with the wet-chemical oxidation, by investigating effects of LT-UHV oxidation after the wet-chemical growth of SiO₂ and before growing Al₂O₃ film on top of SiO₂/Si. This method modifies the SiO₂/Si and is found to (i) decrease defect-level density, (ii) increase negative fixed charge density, and (iii) increase carrier lifetime for Al₂O₃/SiO₂/p-Si, as compared to state-of-the-art SiO₂/p-Si reference interfaces without LT-UHV. X-ray photoelectron spectroscopy shows that the LT-UHV treatment decreases amount of Si⁺³ oxidized atoms in chemically grown SiO₂ and also amount of carbon contamination. In order to pave the way for further tests of LT-UHV in silicon technology, we present a design of simple UHV instrument. The above-described benefits are reproduced for 4-inch <a href="https://www.sciencedirect.com/topics/materials-science/silicon-wafer" title="Learn more about silicon wafers from ScienceDirect's AI-generated Topic Pages">silicon wafers</a> by means of the instrument, which is further utilized to make LT-UHV treatments for complementary SiO₂/Si interfaces of the native oxide at silicon diode sidewalls to decrease the reverse bias leakage current of the diodes.</p><ul>​​​​​​​</ul>